by Tanya Fosdal | May 1, 2021 | research papers
Paper published to ProQuest May 2021 https://www.proquest.com/openview/916e1701ce3a144d4519bfde650ce60f/1?pq-origsite=gscholar&cbl=18750&diss=y
Thermal management is a critical aspect of 3D printing, particularly when working with materials like copper that have high thermal conductivity. Effective thermal management ensures that printed components maintain their structural integrity and performance under varying temperatures during and after the printing process.
In the context of 3D printed heat sinks, understanding thermal management involves analyzing the heat dissipation capabilities of the printed structure. For example, topology optimization can significantly enhance the efficiency of heat sinks by reducing material usage while maximizing surface area for heat exchange, leading to improved thermal performance in real-world applications.
Copper is renowned for its excellent thermal conductivity, making it a preferred material for applications requiring efficient heat transfer. In 3D printing, copper provides unique advantages, including the ability to create complex geometries that traditional manufacturing methods cannot achieve.
Moreover, the use of copper in 3D printing allows for the production of lightweight and intricate designs, which can be crucial in industries such as aerospace and automotive. The combination of copper's thermal properties and advanced printing techniques can lead to innovations in heat sink design, providing enhanced performance in thermal management applications.
Evaluating the thermal performance of 3D printed components involves a variety of methods, including experimental testing and computational simulations. These methods help in understanding how effectively a heat sink can dissipate heat under specific operating conditions.
In the study of the topology-optimized heat sink, methods such as thermal imaging and flow analysis were employed to assess performance metrics like thermal resistance and heat transfer efficiency. By utilizing these evaluation techniques, researchers can derive valuable insights that inform future designs and improvements in 3D printed thermal management solutions.
3D printed heat sinks have a wide range of applications across various industries, including electronics, automotive, and renewable energy. Their ability to be customized for specific thermal management needs makes them an attractive option for engineers and designers.
For instance, in the electronics industry, 3D printed heat sinks can be tailored to fit compact spaces while ensuring optimal heat dissipation from high-performance components. Additionally, the rapid prototyping capabilities of 3D printing allow for quick iterations and adaptations, enabling companies to respond swiftly to evolving thermal management challenges.
